Copper and aluminum parts
Product development for next-generation semiconductors.
The demand for lightweight and high-efficiency thermal management components is expected to continue to increase in the future, and we are advancing the development of cold forging progressive press technology for non-ferrous materials such as aluminum and copper. Our unique CFP (Cold Forging Progressive) technology includes processing methods such as cold forging, allowing for high precision and the ability to process complex and intricate shapes, thereby enhancing mechanical properties and strength. Furthermore, with progressive pressing, we can produce a large number of components at once with stable quality, making it suitable for mass production. The main products we are focusing on are two types of components that are expected to see increased demand in the future: Heat spreaders: Components designed to efficiently transfer heat generated inside electronic devices and home appliances (Materials: Aluminum, Copper) Heat sinks: Components designed to dissipate heat into the air (Materials: Aluminum, Copper) We are advancing new technology development utilizing CFP (Cold Forging Progressive) technology, including fine forging, high-precision molding, and compatibility with various materials. *For more details, please refer to the PDF document or feel free to contact us.
- 企業：SYVEC Corporation Co., Ltd.
- 価格：Other
